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PCB multilayer board refers to the multi-layer circuit board used in electrical products. Multilayer board uses more single panel or double panel wiring board. With a double lining, two one-way for outer layer or two double lining, two blocks of single outer layer of the printed circuit board, through the positioning system and alternate insulation adhesive materials and conductive graphics interconnection according to design requirement of printed circuit board becomes four, six layer printed circuit board, also known as multilayer printed circuit board.
With the continuous development of SMT (surface mount technology) and the launch of the new generation of SMDS (surface mount devices), such as QFP, QFN, CSP, BGA (especially MBGA), electronic products are more intelligent and miniaturized, thus promoting the PCB industry technology reform and progress. Since THE first successful development of high density multilayer (SLC) by IBM in 1991, various countries and major groups have also developed a variety of high density interconnect (HDI) microporous boards. With the rapid development of these processing technologies, PCB design has gradually developed to the direction of multi-layer and high-density wiring. Multilayer PCB has been widely used in the manufacture of electronic products due to its flexible design, stable and reliable electrical performance and superior economic performance.
