All Products
Process Technology Capability
| Project | Capability of Technology |
|
Impedance control Tolerance |
±5% |
|
HDI |
1+N+1 |
|
Aluminum PCB(Metal core) |
volume production |
|
copper core |
volume production |
|
BT material |
volume production |
|
Multiayer |
volume production |
|
Surface finishing |
ENIG/HAL/OSP/Immersion silver/ENIG/flash gold/ENEPIG |
|
Layers count |
2-30 |
|
Maximum Board Size |
610*1800mm 610*1000mm |
|
minimum thickness of board |
0.1mm |
|
Maximum thickness of board |
8.0mm |
|
Thickness of inner core |
0.05mm(Does not contain copper) |
|
Finished copper thickness |
core 80z outer layer 80z |
|
Minimum line width/lin Space |
0.05mm |
|
Mechanical drilling hole size |
0.1mm |
|
Minimum diameter blind hole |
0.075mm |
|
The Max aspect ratio |
18.01 |
