HDI boards are generally manufactured using a lamination method. The more laminations, the higher the technical level of the board. Ordinary HDI boards are basically laminated one time. High-level HDI adopts the laminated technology of two or more times. At the same time, advanced PCB technologies such as stacked holes, electroplated holes, and direct laser drilling are used.
When the density of the PCB increases by more than eight layers, it will be manufactured with HDI, and its cost will be lower than that of the traditional complicated lamination process. HDI board is conducive to the use of advanced construction technology, its electrical performance and signal accuracy are higher than traditional PCB. In addition, HDI board has better improvement for radio frequency interference, electromagnetic wave interference, electrostatic discharge, heat conduction, etc.
Electronic products continue to develop toward high density and high precision. The so-called "high" not only improves the performance of the machine, but also reduces the size of the machine. High-density integration (HDI) technology can make the design of end products more compact, while meeting higher standards of electronic performance and efficiency.
At present, many popular electronic products, such as mobile phones, digital (camera) cameras, notebook computers, automotive electronics, etc., use HDI boards. With the replacement of electronic products and market demand, the development of HDI boards will be very rapid.
